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Kulicke and Soffa Industries Inc KLIC.OQ (NASDAQ Stock Exchange Global Select Market)

22.79 USD
+0.03 (+0.13%)
As of Feb 23
chart
Previous Close 22.76
Open 22.73
Volume 160,214
3m Avg Volume 185,573
Today’s High 22.80
Today’s Low 22.10
52 Week High 28.65
52 Week Low 18.32
Shares Outstanding (mil) 71.10
Market Capitalization (mil) 1,561.31
Forward P/E 18.46
Dividend (Yield %) -- ( -- )

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RECOMMENDATION

Sell Hold Buy
1.33 Mean rating from 3 analysts

KEY STATS

Revenue (mm, USD)
FY18
214
FY17
809
FY16
627
FY15
536
EPS (USD)
FY18
-0.982
FY17
1.554
FY16
0.665
FY15
0.673
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
18.46
1,245.97
Price to Sales (TTM)
vs sector
2.11
2.88
Price to Book (MRQ)
vs sector
1.76
2.28
Price to Cash Flow (TTM)
vs sector
15.64
15.65
Total Debt to Equity (MRQ)
vs sector
1.81
16.61
LT Debt to Equity (MRQ)
vs sector
1.81
8.87
Return on Investment (TTM)
vs sector
9.50
13.72
Return on Equity (TTM)
vs sector
10.19
13.64

EXECUTIVE LEADERSHIP

Garrett Pierce
Chairman of the Board, Since 2014
Salary: --
Bonus: --
Fusen Chen
President, Chief Executive Officer, Director, Since 2016
Salary: --
Bonus: --
Lester Wong
Interim Chief Financial Officer, Senior Vice President - Legal Affairs, Interim Chief Accounting Officer, General Counsel, Since 2017
Salary: $296,806.00
Bonus: $40,000.00
Hoang Hoang
Senior Vice President - Global Sales and Products and Services, Since 2017
Salary: --
Bonus: --
Chan Pin Chong
Senior Vice President , Electronic Assembly, Advanced Packaging-Hybrid, Wedge Bonder, Capillaries and Blades Business Lines, Since 2016
Salary: $277,874.00
Bonus: $105,785.00

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

23A Serangoon North Avenue 5
#01-01 K&S Corporate Headquarter
FORT WASHINGTON     554369

Phone: +656.8809600
Site: www.kns.com/

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.

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