Menu
Search
|

Menu

Close
X

CPS Technologies Corp CPSH.OQ (NASDAQ Stock Exchange Capital Market)

1.00 USD
-0.03 (-2.91%)
As of Jul 17
Previous Close 1.03
Open 1.05
Volume 5,486
3m Avg Volume 4,108
Today’s High 1.05
Today’s Low 0.98
52 Week High 1.82
52 Week Low 0.66
Shares Outstanding (mil) 13.20
Market Capitalization (mil) 14.92
Forward P/E --
Dividend (Yield %) -- ( -- )

LATEST NEWS

ADVERTISEMENT

RECOMMENDATION

No Data Available
Sell Hold Buy

KEY STATS

Revenue (mm, USD)
FY19
5
FY18
22
FY17
15
FY16
15
EPS (USD)
FY19
-0.056
FY18
-0.281
FY17
-0.083
FY16
-0.035
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
--
23.99
Price to Sales (TTM)
vs sector
1.17
37.30
Price to Book (MRQ)
vs sector
1.50
2.52
Price to Cash Flow (TTM)
vs sector
--
15.43
Total Debt to Equity (MRQ)
vs sector
0.00
96.09
LT Debt to Equity (MRQ)
vs sector
0.00
70.59
Return on Investment (TTM)
vs sector
-12.67
7.04
Return on Equity (TTM)
vs sector
-12.67
11.78

EXECUTIVE LEADERSHIP

Francis Hughes
Chairman of the Board, Since 2018
Salary: --
Bonus: --
Grant Bennett
President, Chief Executive Officer, Treasurer, Director, Since 1992
Salary: $177,954.00
Bonus: --
Charles Griffith
Chief Financial Officer, Since 2019
Salary: --
Bonus: --
Thomas Breen
Senior Vice President - Sales and Marketing, Since 2016
Salary: --
Bonus: --
Thomas Culligan
Independent Director, Since 2014
Salary: $174,250.00
Bonus: $26,077.00

COMPANY PROFILE

Sector: Industrials
Industry: Electrical Components & Equipment
Address:

111 S Worcester St
NORTON   MA   02766-2102

Phone: +1508.2220614

CPS Technologies Corporation (CPS) provides material solutions to the transportation, automotive, energy, computing/Internet, telecommunications, aerospace, defense, and oil and gas end markets. Its primary material solution is metal matrix composites (MMCs), which are a class of materials consisting of a combination of metal and ceramic. It designs, manufactures and sells custom MMC components, which manages the performance and reliability of systems in the end markets. It provides lids and heat spreaders used with integrated circuits in Internet switches and routers. It provides baseplates and housings used in modules built with wide band gap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). The Company also assembles housings and packages for hybrid circuits. These housings and packages may include MMC components. Its products are manufactured by processes, including the Quickset Injection Molding Process and the QuickCast Pressure Infiltration Process.

SPONSORED STORIES