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CPS Technologies Corp CPSH.OQ (NASDAQ Stock Exchange Capital Market)

1.64 USD
+0.05 (+3.14%)
As of Feb 16
chart
Previous Close 1.59
Open 1.59
Volume 460
3m Avg Volume 9,951
Today’s High 1.68
Today’s Low 1.59
52 Week High 2.14
52 Week Low 1.04
Shares Outstanding (mil) 13.20
Market Capitalization (mil) 14.92
Forward P/E --
Dividend (Yield %) -- ( -- )

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KEY STATS

Revenue (mm, USD)
FY17
11
FY16
15
FY15
22
EPS (USD)
FY17
-0.070
FY16
-0.035
FY15
0.033
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
--
24.61
Price to Sales (TTM)
vs sector
1.17
53.68
Price to Book (MRQ)
vs sector
1.50
2.68
Price to Cash Flow (TTM)
vs sector
--
16.85
Total Debt to Equity (MRQ)
vs sector
0.00
96.79
LT Debt to Equity (MRQ)
vs sector
0.00
74.65
Return on Investment (TTM)
vs sector
-12.67
7.22
Return on Equity (TTM)
vs sector
-12.67
12.42

EXECUTIVE LEADERSHIP

Grant Bennett
President, Chief Executive Officer, Treasurer, Director, Since 1992
Salary: $177,954.00
Bonus: $21,355.00
Ralph Norwood
Chief Financial Officer, Since 2011
Salary: $153,084.00
Bonus: $16,839.00
Thomas Breen
Senior Vice President - Sales and Marketing, Since 2016
Salary: --
Bonus: --
Mark Occhionero
Vice President - Marketing and Technical Sales and Senior Research Scientist, Since 2004
Salary: $147,805.00
Bonus: $18,291.00
Thomas Culligan
Independent Director, Since 2014
Salary: --
Bonus: --

COMPANY PROFILE

Sector: Industrials
Industry: Electrical Components & Equipment
Address:

111 S Worcester St
NORTON   MA   02766-2102

Phone: +1508.2220614

CPS Technologies Corporation (CPS) provides material solutions to the transportation, automotive, energy, computing/Internet, telecommunications, aerospace, defense, and oil and gas end markets. Its primary material solution is metal matrix composites (MMCs), which are a class of materials consisting of a combination of metal and ceramic. It designs, manufactures and sells custom MMC components, which manages the performance and reliability of systems in the end markets. It provides lids and heat spreaders used with integrated circuits in Internet switches and routers. It provides baseplates and housings used in modules built with wide band gap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). The Company also assembles housings and packages for hybrid circuits. These housings and packages may include MMC components. Its products are manufactured by processes, including the Quickset Injection Molding Process and the QuickCast Pressure Infiltration Process.

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