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ACM Research Inc ACMR.OQ (NASDAQ Stock Exchange Global Market)

7.20 USD
+0.04 (+0.56%)
As of Feb 23
chart
Previous Close 7.16
Open 7.21
Volume 7,456
3m Avg Volume 13,843
Today’s High 7.32
Today’s Low 7.01
52 Week High 8.17
52 Week Low 4.75
Shares Outstanding (mil) --
Market Capitalization (mil) --
Forward P/E --
Dividend (Yield %) -- ( -- )

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RECOMMENDATION

Sell Hold Buy
1.67 Mean rating from 3 analysts

KEY STATS

Revenue (mm, USD)
FY17
19
FY16
19
FY15
17
EPS (USD)
FY17
-0.244
FY16
0.066
FY15
0.078
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
--
1,245.97
Price to Sales (TTM)
vs sector
--
2.88
Price to Book (MRQ)
vs sector
--
2.28
Price to Cash Flow (TTM)
vs sector
--
15.65
Total Debt to Equity (MRQ)
vs sector
--
16.61
LT Debt to Equity (MRQ)
vs sector
--
8.87
Return on Investment (TTM)
vs sector
--
13.72
Return on Equity (TTM)
vs sector
--
13.64

EXECUTIVE LEADERSHIP

David Wang
President, Chief Executive Officer, Director, Since 2016
Salary: --
Bonus: --
Min Xu
Chief Financial Officer, Since 2016
Salary: --
Bonus: --
Chiang Yang
Chief Marketing Officer, Since 2016
Salary: --
Bonus: --
Fufa Chen
Vice President of Sales, Since
Salary: --
Bonus: --
Jian Wang
Vice President - Research & Development, Since
Salary: --
Bonus: --

COMPANY PROFILE

Sector: Technology
Industry: Semiconductor Equipment & Testing
Address:

42307 Osgood Rd Ste I
FREMONT   CA   94539-5062

Phone: +1510.4453700

Acm Research, Inc. develops, manufactures and sells single-wafer wet cleaning equipment, which semiconductor manufacturers uses in manufacturing steps to remove particles, contaminants and other random defects in fabricating integrated circuits, or chips. The Company’s Ultra C equipment is designed to remove random defects from a wafer surface, even at an advanced process node (the minimum line width on a chip) of 22 nanometers (nm) or less. Its equipment is based on its Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) technologies. Its SAPS technology uses alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a uniform manner on a microscopic level. Its TEBO technology provides cleaning for both conventional two-dimensional (2D) and three-dimensional (3D) patterned wafers at advanced process nodes.

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